product description
description: High quality solder paste quality, good wettability, high reliability. Can effectively prevent the collapse of printing and preheating, Sticky lasting, easy to dry, sticky sticky time more than 48 hours. Colorless and transparent, does not affect the test, fine cleaning and cleaning performance. Product wetting, strong anti-dry, long shelf life at room temperature Suitable for Adapted to the mobile phone repair industry, computer digital service industry, High-precision circuit board SMT, BGA welding process specification: Alloy: Sn63 / Pb37 Micron: 25-45um Volume: 10cc Length: 10.5cm Package Included: 1 X solder paste
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